nics

Results 101 - 125 of 152Sort Results By: Published Date | Title | Company Name
By: Ramtron     Published Date: Nov 11, 2009
Today's technological innovation demands high performance coupled with low environmental impact. These dual requirements are driving components of the semiconductor industry which informs many global businesses and consumer lives.
Tags : f-ram, bbsram, random access memory, ram, novram, ecopack, electronics, semiconductor, memory, ramtron
     Ramtron
By: SAS     Published Date: Mar 14, 2014
Jill Dyche and SpectraDynamo explains the importance of understanding how to manage data and issues regarding data categorization, retrieval and quality.
Tags : sas, data categorization, retrieval and quality, spectradynamo, telemetry data, data governance program, data management, data quality, business objectives, quality data, accuracy, lineage, structural consistency, relevant metrics, business relevance, measured value, emergent patterns, quality metrics, data center
     SAS
By: IBM     Published Date: Jun 07, 2012
When we talk about the world becoming increasingly interconnected, instrumented and intelligent, the most ubiquitous example is the smartphone. It collects and disseminates data while its users are at home and on the go, likely serving up just as much-if not more-dynamic, socially driven information as static, always-there web content.
Tags : commerce, ibm, inventory, customer, cross channel, sales
     IBM
By: Dell     Published Date: Aug 16, 2013
"The number of vCPUs should be one of your most important considerations when sizing virtual machines. But getting the right balance — neither over-allocating nor under-allocating — is a challenge. You’ll need to select the number of vCPUs, the size of the virtual disk, the number of vNICs and the amount of memory. With all those variables, a little guidance is in order. Read the White Paper "
Tags : vcpu, sizing, vnics, virtual disk, memory
     Dell
By: Microsoft Dynamics     Published Date: Jul 11, 2007
Until recently, many high-tech manufacturers – especially small and medium-sized businesses – have been able to survive by applying 80% of their operational focus to 20% or less of their critical customers and suppliers. That was then. The new mandate from channel masters is for more intense, collaborative relationships with fewer suppliers.
Tags : industry directions, oem, manufacturing, manufacturer, scm, supply chain, ems, electronics manufacturing, productivity, plm, product lifecycle management, cost control, r&d, r & d, enterprise resource, erm, erp, microsoft dynamics
     Microsoft Dynamics
By: Mentor Graphics     Published Date: Apr 03, 2009
For advanced signaling over high-loss channels, designs today are using equalization and several new measurement methods to evaluate the performance of the link. Both simulation and measurement tools support equalization and the new measurement methods, but correlation of results throughout the design flow is unclear. In this paper a high performance equalizing serial data link is measured and the performance is compared to that predicted by simulation. Then, the differences between simulation and measurements are discussed as well as methods to correlate the two.
Tags : mentor graphics, equalized serial data links, design flow, high loss channels, tektronix, pcb, bit error rate, ber, ieee, serdes, simulation, system configuration, mentor graphics hyperlynx, simplified symmetric trapezoidal input, duty cycle distortion, ber contours, electronics, analog models, backward crosstalk, capacitive crosstalk
     Mentor Graphics
By: Mentor Graphics     Published Date: Apr 03, 2009
High Density Interconnect (HDI) is being used more often to meet the growing need for more complex designs in smaller form factors. Beyond some of the more obvious electrical effects of using smaller vias, there is also an impact to the power integrity of a board using HDI. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This paper will examine and quantify these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI.
Tags : power integrity effects, mentor graphics, high density interconnect, hdi, chip pinouts, perforation, multilayer or build-up multilayer, bum, sequential build-up technologies, sbu, buried via holes, bvhs, dielectric materials, photosensitive, laser drilling, plasma drilling, microvia, plated through-holes, pths, power distribution network
     Mentor Graphics
By: Mentor Graphics     Published Date: Sep 04, 2009
This paper looks at the issues, materials and current processes being researched to create this integrated Opto-Electronic Circuit Board by European, Japanese and North American organizations.
Tags : mentor graphics, high density interconnect (hdi), high speed applications, opto-electronics, photonics, pcbs, opto-electronic circuit board, eobc-optofoil, univ. of ulm, fraunhafer inst, daimler-chrysler, siemens, truemode, terahertz, polyguide, dupont, topcat, nist, goodyear, jiep
     Mentor Graphics
By: Direct Message Lab     Published Date: Oct 02, 2009
Participation in social media has become a necessity. Done properly, social media can deliver new users, drive revenue and increase engagement. DML has asked its partners to share their approach to social media from a strategic standpoint and the day-to-day mechanics of managing their social presence.
Tags : social media, social networks, social media management, social media agency, dml, direct message lab, facebook, twitter
     Direct Message Lab
By: Dell Software     Published Date: Aug 15, 2013
Getting the right balance of vCPUs is a challenge, as well as the right virtual disk size, the number of vNICs and the amount of memory. With all those variables, a little guidance is in order. Read the White Paper >>
Tags : dell, vcup, virtual disk, memory, machines, technology, it management, storage
     Dell Software
By: IBM     Published Date: Feb 11, 2015
Safety certification for avionics hardware and software is an expensive, complicated process, but absolutely necessary to ensure safe skies for commercial aircraft passengers and military jets flying in the national airspace. Now unmanned aircraft flight critical electronics will also have to meet these same safety requirements as the U.S. Federal Aviation Administration (FAA) starts to open up the national airspace to unmanned aerial systems (UASs). While the rules are still being drawn up, embedded software and hardware designers are already looking at ways for UAS platform integrators to solve certification challenges and manage the process of compliance with safety certification standards such as DO-178B & C. This webcast of industry experts will discuss how to enable safety certification of UAS platforms through efficient and cost-effective solutions.
Tags : uas platforms, safety certification, avionics hardware, cost-effective solutions, certification challenges, it management, platforms
     IBM
By: Cisco     Published Date: Jan 15, 2015
Traditional 100 Gbps pluggable optics (CFP and CFP2) haven't been keeping pace with the ASIC/CMOS technology scale, which drives network bandwidth. CMOS photonics is closing the gap. By taking advantage of CMOS technology, Moore's Law can be applied to optical network applications for the rst time, and Cisco has delivered on Cisco CPAK™—a CMOS photonics-enabled technology.
Tags : cloud, growth, traffic, projection, account, network, it management, enterprise applications
     Cisco
By: IBM     Published Date: Feb 27, 2014
Organizations developing products and systems in industries such as automotive, aerospace and defense, medical devices and consumer electronics are undergoing a transformation driven by the rapid growth in functionality delivered by software and electronics. This paper outlines an approach for using this shift to gain a competitive advantage.
Tags : ibm, ibm software, systems engineering, business agility, smart products, traceability, engineering information, collaboration, engineering disciplines, business objectives, change management, compliance standards, systems age, engineering process, information integration, communication, it management
     IBM
By: IBM     Published Date: Apr 15, 2014
Organizations developing products and systems in industries such as automotive, aerospace and defense, medical devices and consumer electronics are undergoing a transformation driven by the rapid growth in functionality delivered by software and electronics. This paper outlines an approach for using this shift to gain a competitive advantage.
Tags : ibm, product development, systems development, it engineering, business objectives, traceability, collaboration, software development
     IBM
By: Symantec Corporation     Published Date: Oct 03, 2013
Over the past decade, businesses have had to adapt to an array of technical changes, including an increasingly hostile cyber environment. We saw the early precursors of cybercrime decades ago when computer use was limited to a relatively small group of specialists and electronics enthusiasts. Innovative programmers, some still in high school, would find ways to display annoying messages on their friends’ computers and from there spread to other devices via shared floppy disks.This kind of part practical joke-part vandalism form of malware has been overshadowed by the more serious, technically complex, and financially lucrative form of today’s cybercrime. In this guide, we will examine major types of threats to information security that businesses face today as well as techniques for mitigating those threats. One of the most important tools available to us is SSL technology.
Tags : symantec, security, threat, report, key findings, best practice, strategy, technology
     Symantec Corporation
By: IBM     Published Date: Mar 10, 2015
Organizations developing products and systems in industries such as automotive, aerospace and defense, medical devices and consumer electronics are undergoing a transformation driven by the rapid growth in functionality delivered by software and electronics. This paper outlines an approach for using this shift to gain a competitive advantage.
Tags : ibm, systems development, product development, traceability, customer lifecycle, software development, it management
     IBM
By: Alacritech     Published Date: Aug 21, 2009
Today's systems and servers need an efficient way to move the ever-increasing amounts of data over networks. Many companies have introduced solutions such as TCP/IP Offload Engines (TOE) Network Interface Cards (TNICs), Network Interface Cards (NICs), and iSCSI Host Bus Adapters (HBAs) to solve efficiency and throughout challenges. However, the functionality of these solutions is quite varied, and in some cases, rapidly becoming obsolete.
Tags : data transfer, tcp/ip, tnic, nic, hba, iscsi, alacritech, networking
     Alacritech
By: IBM     Published Date: Jun 19, 2008
Storage infrastructure simplification is an important step an electronics business can take toward meeting the needs of an on-demand business environment. The IBM System Storage DS Family can support business continuity and improve information lifecycle management with competitively priced storage options. Learn how the IBM Systems Storage DS Family is an ideal partner for businesses in the electronics industry looking for secure and resilient data storage.
Tags : ibm, express seller, storage management, storage, infrastructure
     IBM
By: IBM     Published Date: Mar 17, 2009
PTC, the Product Development Company® today announced that Samsung Electronics Co., LTD (SEC), a leading digital products manufacturer of mobile phones, televisions, and semiconductors, has selected PTC Windchill as its digital product development data repository to manage an integrated BOM of mechanical, electrical and software data across its globally distributed product development environment. Windchill is the standard enterprise PLM solution at SEC because of its powerful, Web-based support of key product development processes on a single technology architecture and execution environment.
Tags : ibm, telelogic, samsung, ptc windchill, press release, electronics industry, product development, global bom, product lifecycle management, content management, dynamic publishing, enterprise applications
     IBM
By: IBM     Published Date: Mar 17, 2009
For most electronics and high tech companies, the Bill of Material (BOM) is the central hub of product definition activities. It conveys the information needed by various departments to get the product to market. However, current BOM development processes are not well-suited to today’s requirements.
Tags : ibm, telelogic, global bom development, bill of material, product definition, ibm rational, product development, enterprise applications
     IBM
By: IBM     Published Date: Mar 17, 2009
For most electronics and high tech companies, the bill-of-materials (BOM) is the central hub of product definition activities. It conveys the information needed by various departments, such as Engineering, Procurement and Manufacturing, to get the product built. However, current BOM development processes are not well-suited to today’s realities.
Tags : global bom, single enterprise solution, bom, bill of materials, product development system, operational efficiency, electronics, manufacturing efficiency, printed circuit boards, pcbs, ibm rational clearcase, clearquest, assemble-to-order (ato), engineer-to-order (eto), it management, enterprise applications
     IBM
By: IBM     Published Date: Mar 17, 2009
Download this webcast replay to learn more about: Integrating Software Development and System Engineering, Integrated Requirements Engineering, Cross-Discipline Change and Configuration Management
Tags : ibm, telelogic, automotive system designs, mechatronics, electronic and software engineering, ptc, ibm rational, integrated requirements engineering, enterprise applications
     IBM
By: IBM     Published Date: Mar 17, 2009
CPDA’s Product Lifecycle Management (PLM) research programs target the critical decisions in Product Lifecycle Management challenging Design, Engineering, Manufacturing, and Information Technology managers and executives. CPDA’s PLM collaborative research programs provide indepth analysis of strategies, products, issues, processes, technologies, trends, case studies, and surveys for assessing technology, business goals and objectives, and implementation road maps.
Tags : ibm, telelogic, addressing future automotive needs, model-driven systems, product value management, plm, computer-aided design, cad, design/simulation council, product value management, software level modeling, model-driven systems, automotive trends, sysml, csrs, mechatronics, enterprise applications
     IBM
By: IBM     Published Date: Mar 24, 2009
Electronics and Software Engineering are quickly merging with traditional Mechanical Engineering to create a new paradigm in auto manufacturing: Mechatronics. Industry experts predict that this shift will bring about profound advances in automotive product development. Unfortunately, existing IT and process infrastructures do not provide sufficient capabilities to support the new paradigm: multiple data silos, a lack of standardized processes, and integration issues on a tool level (Mechanical, Electronic, Software) continue to pose serious obstacles to development efficiency, and remain a frequent source of delays, quality issues and cost increases.
Tags : ibm, ibm telelogic, automotive system design, mechanical engineering, mechatronics, oems, electronic stability programs, esp, electric overlay steering, ancillary systems, active lighting, pdm, product data management, pcb-layout domains, ptc, automotive product development system, sourcing, engineering, engineering change orders, ecos
     IBM
By: PTC     Published Date: Aug 21, 2009
Download this report on how to implement a successful environmental compliance strategy for the long term. Learn about new strategies for complying with upcoming environmental regulations, as well as the compliance shortcomings common to many companies in a new research report by AberdeenGroup.
Tags : compliance, environmentalism, epa, manufacturing, responsibility, consumer electronics, ptc
     PTC
Start   Previous    1 2 3 4 5 6 7    Next    End
Search White Papers      

Add White Papers

Get your white papers featured in the insideHPC White Paper Library contact: Kevin@insideHPC.com